Every R&D claim in §6 maps to a purchasable line in the equipment annex, and every line maps back to a claim. Total ¥4,800,000 (¥1.5M municipal + ¥3.3M self-raised), 12 line items, 116 units, composite Shenzhen/CN content ≈78% against a ≥70% commitment.
| Layer | Capability | Instruments behind it |
|---|---|---|
| Packet layer | eBPF/XDP AI takeover: silent C2 drop or synthetic-response injection at nanosecond scale (§6.2) | 100 Gbps hardware TAPs ×2, datacenter switches — 100% CN |
| RF spectrum | Phantom BLE/Wi-Fi populations, GPS/PTP spoofing detection (§5.4) | USRP N320 ×2, HackRF/BladeRF ×30 (90% SZ), 3m anechoic chamber 100% SZ |
| Powerline | G3-PLC covert mesh inside RF-jammed premises (§6.5) | 50× QCA7000/HiSilicon coupling kits — 95% SZ/CN |
| Silicon | Voltage fault-injection self-audit; thermal zeroization on sacrificial nodes (§6.3–6.4) | ChipWhisperer-Husky ×3, 8 GHz Infiniium scopes ×2, thermal chamber (−40–150 °C) 100% CN |
| Compute | 42-server MCP mesh, local Qwen/DeepSeek inference (§4.2, §4.5) | 4× dual A6000 MCP nodes (80% CN/SZ), 4× ClickHouse NVMe nodes, 15 R&D workstations |
By explicitly detailing the Keysight Infiniium scopes and the ChipWhisperer-Husky platforms, XCOM proves it understands the deep physics of hardware security: nanosecond voltage droop, EM side-channel leakage, secure-boot trust anchors, thermal limits of silicon.
By explicitly calling out the QCA7000 PLC modules and the 100G TAPs, XCOM demonstrates that its powerline and XDP claims rest on real, orderable engineering parts — not theoretical whitepaper concepts.
Procurement methods (annex D.2): general equipment (<¥300k) via 询价采购 three-quotation; specialised imported instruments (8 GHz scope, USRP) via 进口产品审批 import approval then single-source/competitive negotiation; custom builds (chamber, fixtures) via 竞争性磋商 with qualified Shenzhen integrators.
Asset management (annex D.3): all municipal-funded equipment enters the fixed-asset ledger with “深圳市科技创新委员会资助项目” labels; no disposal, transfer or diversion without the competent authority's approval during the project period.
Local-content commitment (annex D.1): chamber, thermal chamber, PLC modules, switches and lab wiring are 100% Shenzhen-local/domestic; compute and storage nodes are assembled and liquid-cooling-integrated in Shenzhen; composite ≈78% vs the ≥70% annex commitment.